Monday 15th April 2024 starting at 18:30 CET

18:30 Pre-conference networking drinks reception

Tuesday 16th April 2024 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis - Conference Chairs PIC Packaging: Securing Optimal Integration and Performance 09:00 Electrooptic Glass Substrates for Photonic Packaging Presented by Andreas Matiss - Corning 09:15 Industry proven Photonic Wire Bonds and Facet-Attached Micro-Optical Elements: from Telecom/Datacom to Quantum Applications Presented by Philipp-Immanuel Dietrich - Vanguard Automation 09:30 Optimizing Cost and Scaling Efficiency in Swept Wavelength Testing for Alignment and Packaging of PIC Presented by Matt Adams - VIAVI Solutions 09:45 Advancing Optical Testing for Photonic Integrated Circuits: From Prototype to Production Scale-Up Presented by Ricardo Arias - Luna Innovations 10:00 Towards a Comprehensive, Multiphysics Design Solution for Co-packaged Optics Presented by Ahsan Alam - Ansys Optics 10:15 Aligned additive microfabrication for advanced optical packaging Presented by Jochen Zimmer - Nanoscribe 10:30 Morning Break 11:00 Breaking the barriers for high frequency packaging Presented by Guillermo Carpintero - LEAPWAVE TECHNOLOGIES 11:15 Technology Developments & Equipment Concepts for Scaling Up Photonics Production for Datacenters Presented by Malte Ennen - ficonTEC 11:30 As Photonics Applications Multiply, New Ways to Subtract Costs Presented by Scott Jordan - Physik Instrumente 11:45 Advances in PIC Manufacturing for Sensing and Datacom Applications – All Thanks to Nanoimprint Lithography Presented by Jonas Khan - EV Group 12:00 AIM Photonics Foundry providing Co-Process and Co-Development to Address Challenges in Photonic Integrated Circuit (PIC) Packaging Presented by David Harame - AIM Photonics 12:15 Impact of PIC device architecture and integration concept on packaging and assembly Presented by Helen Waechter - Helbling Technik Bern AG 12:30 PANEL SESSION Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging PHIX, Lightwave Logic Inc, Tyndall National Institute, and POET Technologies Moderated by Jose Pozo, CTO at OPTICA 13:00 Lunch Break Hybrid PICs: Pioneering New Frontiers in Photonic Integration Sponsored by OPTICA 14:15 Designing high power hybrid integrated tuneable lasers for automotive LiDAR Presented by Ruud Oldenbeuving - imec 14:30 Advances in hybrid Silica-Nitride waveguides Presented by Henk Bulthuis - Broadex Technologies 14:45 Unlocking the potential of hybrid/heterogeneous PIC design Presented by Martin Fiers - Luceda Photonics 15:00 TFLN PIC Platform: Unleashing Monolithic power to Enhance Hybrid/Heterogeneous PICs Presented by Hamed Sattari - CSEM 15:15 High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence. Presented by Michael Lebby - Lightwave Logic Inc 15:30 Advanced Photonic Integrated Circuit Testing: APEX Technologies’ solution for High Precision Optical Instrumentation Presented by Tomy Marest - APEX Technologies 15:45 BTO-powered PICs for communication and switching Presented by Cyriel Minkenberg - Lumiphase 16:00 Afternoon Break 16:30 Heterogeneous integration to capitalize on upcoming markets, the new IPSR-I global roadmap update Presented by Peter van Arkel - PhotonDelta 16:45 Advancements in Optically Enhanced MEMS Inertial Sensors: Prototyping and Roadmap Challenges for Consumer Markets (Video presentation) Presented by Lia Li - Zero Point Motion 17:00 Augmented Silicon Photonics for demanding Data Center and AI/ML network fabrics Presented by Yannick Paillard - SCINTIL Photonics 17:15 Silicon-organic hybrid electro-optic modulators for next generation optical interconnects Presented by Adrian Mertens - SilOrix 17:30 Heterogeneous Integration of Photonic Devices on Silicon Presented by Jonathan Klamkin - UCSB (University of California Santa Barbara) 17:45 Photonic Integrated Circuits: Surface Coupling Lasers using InP as an integration platform Presented by Bill Ring - Vector Photonics 18:00 Sputter deposited Al2O3: an ultra-low loss integrated photonic platform for broadband operation from the UV till the mid-IR Presented by Sonia M. Garcia-Blanco - ALUVIA Photonics 18:15 Closing Remarks 18:20 Networking Drinks / Dinner Reception

Wednesday 17th April 2024 starting at 08:00 CET

08:00 Registration and welcome refreshments 08:50 Housekeeping by Michael Lebby and David Cheskis - Conference Chairs Rapid Scaling: Foundries Fuelling PICs' Mass Production 09:00 A view from the Foundry: Silicon Photonics Presented by Anthony Yu - GlobalFoundries 09:15 Low Loss Photonic Integrated Circuits: From Prototype to Volume Presented by Michael Geiselmann - LIGENTEC 09:30 Silicon photonics for AI/HPC Optical Interconnects Presented by Philippe Absil - imec Power Efficiency: Minimizing Consumption in PICs 09:45 The evolving role of optics in AI Clusters Presented by Vlad Kozlov - LightCounting PIC Size and Simulation: Enhancing Design Efficiency 10:00 A perspective on recent trends in inverse design of integrated photonic devices and circuits Presented by Wolfger Peelaers - Hewlett Packard Enterprise 10:15 Efficient design techniques for custom PDKs protecting your IP Presented by Andrzej Połatynski - VPIphotonics 10:30 Morning Break Accelerating PIC Adoption in Established Markets Sponsored by LioniX International 11:10 Design to Device: Accelerating PIC adoption by lowering entry barriers to turnkey photonic solutions Presented by Amitesh Singh - LioniX 11:25 Transforming point-of-care diagnostics: The power of silicon plasmonic biosensors in the battle against acute infections Presented by Dimitris Tsiokos - bialoom 11:40 Is integrated optics a perfect fit for next generation of Access Networks? Presented by Prof. Dr. Antonio Teixeira - PICadvanced 11:55 Innovate with Confidence: Strategies for reliable PIC design Presented by Ronald Broeke - Bright Photonics 12:10 Scaling photonic integration and packaging of hybrid multi-chip assemblies using 3D lithography Presented by Dr. Laura Horan - Vanguard Automation 12:25 Opportunities for Photonics in Datacenter and High-Performance Computing (HPC) Infrastructure Presented by Remco Stoffer - Synopsys 12:40 Lunch Break 13:55 Silicon Photonics Market and Applications: from Optical Transceivers to Emerging Uses Presented by Eric Mounier - Yole Group 14:10 Semiconductorization of Photonics using Silicon Optical Interposer Presented by Raju Kankipati - POET Technologies 14:25 Efficient Test of PICs for High-Performance Computing Applications Presented by Daria Lavrova - Keysight Technologies 14:40 Revolutionizing Architecture and Components for New Generation Energy-Efficient High-Density Photonic Integrated Coherent Transceivers Presented by Tomoyuki Akiyama - PETRA/Fujitsu 14:55 Opportunities and Challenges for Optics in AI Factories Presented by Yannick De Koninck - NVIDIA 15:10 PIC Solutions for Established and Novel Optical Communication Applications Presented by Mehrdad Ziari - Infinera 15:25 Opportunities for Silicon Photonics: Developments and Applications Presented by James Falkiner - IDTechEx 15:45 Closing Remarks