Dr. Bernd Dielacher is business development manager at EV Group (EVG) where he evaluates global market trends and develops growth opportunities for EVG's bonding, lithography and nanoimprint businesses with a particular focus on the MEMS and biomedical technology market. Bernd holds a master’s degree in Microelectronics from Vienna University of Technology and received a PhD in Biomedical Engineering from ETH Zurich.
Applications for PIC are diversifying constantly. Next to optimized solutions for optical connectivity, high-speed data transfers in data centers, telecom networks they are considered to enable novel type of optical sensors e.g. in LiDAR components for autonomous driving. This in turn is driving the importance of dedicated manufacturing processes and packaging flows which are developed for and aligned with the specific needs of PIC, to enable most advanced, compact and reliable devices. Wafer-level nanoimprint lithography (NIL) has come into industry focus as manufacturing technology of choice for photonic integrated circuits (PIC). In this talk we will show, how NIL helps to solve key challenges in this area and how to cost-effectively scale up the production.