Andreas Matiss
Program Leader for On-Board Connectivity
Corning
Dr. Andreas Matiss has received his PhD in 2008 in the field of Semiconductor Technologies and Optoelectronics from the University of Duisburg-Essen in Germany. After his PhD he worked for u2t photonics (now Coherent) in Berlin, Germany, where he has led the development of compound semiconductor based optoelectronic technologies for coherent long-haul optical communication components. In 2012, Andreas joined Corning Optical Communications in Berlin, Germany. He is currently responsible for the Advanced Optical Components and Integration group in the Optical Connectivity Solutions technology division.
Andreas has over 15 years of experience in the field of optical communications, fiber optics connectivity, semiconductors technologies, photonic packaging and microelectronics. He has a deep understanding of the industry and has played a leading role in the development of cutting-edge optical technologies that have been deployed in optical communication systems.
Presentations
Optical Interconnects for Advanced Packaging Glass Substrates
This talk will discuss the use of optical fiber and connectivity for advanced glass substrates in established markets. Optical fiber has been increasingly used for data transmission due to its high bandwidth and low attenuation. With the growing demand for faster transfer rates, optical fiber is starting to move inside datacenter switching equipment to provide higher bandwidth density, lower power consumption and reduced costs compared to electrical interconnects. The use of optical waveguides in glass substrates in conjunction with optical fiber can lead to improved performance and reduced packaging complexity. This talk will cover the benefits of using optical fiber with advanced glass substrates, as well as practical considerations for implementation.