With more than 25+ years’ experience within the semiconductor industry, Eric Mounier PhD. is Director of Market Research at Yole Intelligence, part of Yole Group.
Eric provides daily in-depth insights into current and future semiconductor trends, markets and innovative technologies (such as Quantum computing, Si photonics, new sensing technologies, new type of sensors ...). Based on relevant methodological expertise and a strong technological background, he works closely with all the teams at Yole to point out disruptive technologies and analyze and present business opportunities through technology & market reports and custom consulting projects. With numerous internal workshops on technologies, methodologies, best practices and more, Yole’s Fellow Analyst ensures the training of Yole’s Technology & Market Analysts.
In this position, Eric Mounier has spoken in numerous international conferences, presenting his vision of the semiconductor industry and latest technical innovations. He has also authored or co-authored more than 100 papers as well as more than 120 Yole’s technology & market reports.
Previously, Eric held R&D and Marketing positions at CEA Leti (France).
Eric Mounier has a PhD. in Semiconductor Engineering and a degree in Optoelectronics from the National Polytechnic Institute of Grenoble (France).
Future optical modules must be smaller to decrease power consumption and increase data throughput. As such, progress in integration of optical component technologies has dramatically cut complexity and cost of the modules. Networking hardware is seeing more common components as technology advancements enable tighter integration of communication and computing technologies in commercial systems. As a result, new very-short-reach optical interconnects have emerged for High Power Computing (HPC) and its new disaggregated architecture. Disaggregated design distinguishes the compute, memory, and storage components found on a server card and pools them separately. Photonic Integrated circuit (PIC) is a key enabling architecture for further development of optical interconnect solutions needed to address growing internet traffic. Today Silicon Photonics (SiPho) PIC plays an important role in 500 m and 80 km pluggable interconnects and is a key driving platform for co-packaged optics assembly for networking and HPC. InP PIC is an emerging technology platform targeting coherent links for long-haul applications. With highly integrated optics and silicon chips, new engineering capabilities and foundries will be greatly desired. This presentation will show global trends, future technologies and market forecast for the PIC industry.