Now photonic integrated circuits are maturing and being commercially implemented, the bottleneck for further scaling in performance and production becomes clear. While InP PICs have supperior performance in terms of component bandwidth and availability of efficient native-substrate sources, their manufacturability is limited by dedicated fabrication flows. Silicon photonics, on the other hand, lacks native sources and had limited-efficiency modulators, but benefits from a mature fabrication and assembly infrastructure. Further scaling of PICs will require a form of heterogeneous integration of InP on silicon. I will discuss the various techniques.
Martijn Heck received the M.Sc. degree in applied physics (2002) and the Ph.D. degree in electrical engineering (2008) from the Eindhoven University of Technology, The Netherlands. From 2007 to 2013 he held various postdoctoral research positions, respectively at the COBRA Research Institute and the Laser Centre, Vrije Universiteit, The Netherlands, and the University of California at Santa Barbara, USA. He is currently an Associate Professor with the Department of Engineering, Aarhus University, Denmark, where he leads the Photonic Integrated Circuits Group. His research mainly focuses on the applications of photonic integration in microwave and terahertz photonics, sensors, quantum technology and energy-efﬁcient interconnects.