PRESENTATION
Scaling 3D laser lithography-based packaging of hybrid multi-chip assemblies from prototyping to volume production
Driven by mega trends such as the IoT and autonomous driving, PICs have been growing at a CAGR of greater 25%. Conventional packaging approaches are unlikely to keep up with short innovation cycles and future volume requirements. 3D laser lithography based Photonic Wire Bonding allows for compact chip-to-chip packaging with high yields, complying with tight optical specification and environmental requirements. Micro-optical lenses can be directly fabricated on wafer-level, allowing for passive alignment of PICs with low coupling losses, while also meeting industrial reliability specifications. See how these technologies have been implemented in a reconfigurable tool chain which scales from prototyping to high-volume production.
Thorsten Mayer
Vanguard Automation
As Chief Executive Officer (CEO) Thorsten is responsible for Vanguard's strategy development and execution to ensure sustainable growth and innovation. He joined Vanguard in November 2020 and served as Chief Operating Officer (COO) for one year before he stepped into the role of CEO. Prior to joining Vanguard Automation, Thorsten has held several regional and global leadership positions at National Instruments (NI) in R&D, strategic marketing, sales, and operations. Amongst his roles at NI he served as Managing Director for East-Central Europe quadrupling revenues and profits over seven years and led high-impact transformational projects at the global level as Chief of Staff and Global Head of NI’s Alliance Business & Strategic Partnerships. He has lived and worked in four countries. Thus, he offers U.S. Corporate, European and Asian experience and a strong international background to business development and geographical expansion. Thorsten has also been contributing through his voluntary work at SWAN Impact Network, both as investor and advisor, to startups with measurable social or environmental impact. Thorsten holds a Master’s degree in Aerospace Engineering.