PRESENTATION
Integrated Photonic Packaging from prototype to production scale up
How to layout a chip that allows for easy prototyping and what needs to be done to scale up the production afterwards. What are do’s and don’ts when packaging optical chips and where are limitations in the packaging field come from, and how can you overcome those. What can you do to prevent unexpected high cost on packaging and how do you budget for this?
Jeroen Duis
PHIX
Jeroen received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics where he gained experience on III-V materials and was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX Photonics Assembly where he is responsible for the commercial activities and the strategic direction for the packaging. He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.