Photonic wire bonding allows to combine the complementary strengths of different optical integration platforms in advanced photonic multi-chip modules leading to compactness with high performance and great design flexibility. The technique relies on highly precise direct-write 3D laser lithography for printing of freeform single-mode waveguides between optical dies, thereby offering a path towards fully automated mass production without the need for active alignment. Additionally, 3D nano-printing can also be used to fabricate facet-attached beam-shaping elements on optical chips and fibers, allowing for low-loss coupling with high alignment tolerance and for wafer-level probing of optical devices.
As Head of Applications Engineering, Support and Services, Sebastian oversees all of Vanguard Automation’ customer engagements including technical demonstrations, delivery of products and solutions as well as customer success. In this role he also spearheads many of Vanguard’s business development and strategic marketing efforts. Prior to joining Vanguard Sebastian worked in academia as well as in the automotive industry (Harman International) in Germany, the United Kingdom, Italy, and Russia. Sebastian holds a PhD (Dr. rer. nat.) degree in Physics from the Karlsruhe Institute of Technologies for which he was granted a scholarship of the Heinrich Böll Foundation. His research background is in superconducting quantum circuits such as qubits. Sebastian contributes extensive experience in nanofabrication, high frequency applications, project management, leadership and quality testing. Sebastian serves voluntarily as member of the selection committee for new scholars of the Heinrich Böll Foundation.