PRESENTATION
Flexibility and shorter changeover times in packaging
In the world of photonics, the need for validating and optimizing packaging performance quickly and reliably is growing. In a joint project with AMO and Black Semiconductors, Etteplan developed a solution for the back-end assembly of photonic products where flexibility and short changeover times in the production sequence of the packaging solution is a crucial element. This flexibility was important to optimize and shorten the lead time of the R&D process. Based on open source software, Etteplan developed this solution for their machine platform combining a simple and efficient block based programming interface, enabling product companies and foundries to program and configure the machine’s production sequence and parameters themselves.
Niels Jansen
Etteplan
As Engineering Manager, Niels is responsible for the Engineering department at Etteplan Engineering Solutions in the Netherlands, including mechanical, electrical, software and process engineering. In his role, he is also responsible for the development of the machine platform and manufacturing production solutions, as well as the technology roadmap. Niels is member of the Management Team (MT) of Etteplan NL. Niels received his Master’s degree in Systems and Control from the Eindhoven University of Technology with the classification with great appreciation. Since then he worked for several companies in the industrial automation in the Netherlands, where he gained positions as group leader and manager for engineering teams, responsible for the development and implementation of industrial automation solutions.