Optimizing performance of the PIC using different material platforms such as InP, SiPh, GaAs, electro-optical polymers, passive polymers, dielectrics, glass, silica, SiGe, BTO, metal/plasmonics etc. Laser to PIC coupling techniques.

Use of semiconductor foundries to help scale PIC technologies, and implementing new and novel technologies and tools/process PDKs to optimize performance. PIC production and manufacturing techniques.

Chip-scale packaging and interposer integration for advanced packaging and assembly and ADKs (assembly development kits) for PICs. Use of robotics and automation for volume packaging, assembly and testing of PICs.

Performance and design of PICs implemented into optical wireless applications such as sensing, automotive (LIDAR), structured light. What technologies should be adopted and how should the hybrid PIC be designed, especially for ultra-high volumes.

What is needed to accelerate deployment of PICs in the hyper scale environment such as data centres, metro, access and optical networks in general? Progress on PICs in telecommunications, and advanced transmission systems.

What role will the PIC play in challenging and new applications such as: quantum computing, super low temperatures/cryo, programmable photonics, PIC based computational architectures etc.